Printed circuit board and fabrication method thereof

Details Printed circuit board and fabrication method thereof Printed circuit board and fabrication method thereof

2007-03-20

2007-03-20

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S106000, C257SE21499

Reexamination Certificate

active

11165173

ABSTRACT:
The present invention provides a printed circuit board which is capable of air-tightly sealing a functional surface of a device and of preventing excessive stress from acting on the device itself or a conductive bump conjugating the device with a wiring board and a method of fabricating the printed circuit board. The printed circuit board has a device mounted in a hollow formed in a wiring board via a plurality of conductive bumps. In the printed circuit board, a gap is formed between a functional surface of the device and an inner surface of the hollow, and a sealing member is disposed around side surfaces of the device so as to air-tightly isolate the gap and a space within the hollow excepting the gap.

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