Printed circuit board and electronic package using same

Details Printed circuit board and electronic package using same Printed circuit board and electronic package using same

2006-01-10

2006-01-10

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S767000, C174S255000

Reexamination Certificate

active

06985362

ABSTRACT:
A printed circuit board on which a semiconductor chip is flip chip mounted, comprising a circuit pattern to which a conductive bump, provided in a corner portion of a semiconductor chip, is connected, an insulating layer for holding the circuit pattern, and a protection pad which is positioned on the insulating layer relative to the circuit pattern, to which the conductive bump is connected.

REFERENCES:
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patent: 6015722 (2000-01-01), Banks
patent: 6092280 (2000-07-01), Wojnarowski
patent: 6254971 (2001-07-01), Katayose
patent: 6329609 (2001-12-01), Kaja et al.
patent: 2001/0013423 (2001-08-01), Dalal

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