Printed-circuit board and electronic device

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

Reexamination Certificate

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Details

C174S260000, C174S262000, C361S816000, C361S818000

Reexamination Certificate

active

11017712

ABSTRACT:
A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width of more than 1 millimeter. Moreover, the shield pattern layer includes a shield pattern that is, from a plane view, overlapped on the wide-pattern area, and grounded without being electrically connected to an internal layer of other wiring pattern layers.

REFERENCES:
patent: 5270493 (1993-12-01), Inoue et al.
patent: 5592391 (1997-01-01), Muyshondt et al.
patent: 5761049 (1998-06-01), Yoshidome et al.
patent: 6418032 (2002-07-01), Hirata et al.
patent: 6707682 (2004-03-01), Akiba et al.
patent: 6717494 (2004-04-01), Kikuchi et al.
patent: 6937480 (2005-08-01), Iguchi et al.
patent: 5-275863 (1993-10-01), None
patent: 2003-272467 (2003-09-01), None

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