Printed circuit board and electronic device

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S262000, C361S792000

Reexamination Certificate

active

07863525

ABSTRACT:
According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.

REFERENCES:
patent: 5784262 (1998-07-01), Sherman
patent: 6587353 (2003-07-01), Sumikawa et al.
patent: 07-321247 (1995-12-01), None
patent: 11-220247 (1999-08-01), None
patent: 2000-261110 (2000-09-01), None
patent: 2001-068594 (2001-03-01), None
patent: 2001-168511 (2001-06-01), None
patent: 2001-332653 (2001-11-01), None
patent: 2005-108993 (2005-04-01), None
patent: 2006-114777 (2006-04-01), None

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