Printed circuit board and electronic component device

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S260000

Reexamination Certificate

active

07985926

ABSTRACT:
A base material in which a base insulating layer and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts. A hole is formed in a region under a predetermined terminal part where the base insulating layer is formed by directing a laser beam from below. A reinforcing board having a through hole is attached to the lower surface of the base insulating layer by a sheet-like adhesive having a through hole, with the holes being aligned with one another. An opening space formed by the holes is filled with metallic paste by screen printing. In this way, a printed circuit board is fabricated. An electronic component is mounted on this printed circuit board.

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Office Action dated Mar. 26, 2010 in counterpart Chinese Application No. 200710167549.9, 6 pages.
Office Action Issued Nov. 30, 2010 in Japanese Application No. 2006-292803.

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