Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-29
2011-03-29
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S768000, C361S773000, C361S774000
Reexamination Certificate
active
07916496
ABSTRACT:
According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package including a parallelepiped body, and solder balls provided on a face of the parallelepiped body; a printed wiring board including a mounting face, the mounting face configured to mount the plurality of solder balls; a first bonding member including a first glass transition temperature, the first bonding member disposed around the parallelepiped body and configured to bond the semiconductor package and the printed wiring board; an electronic component mounted on the mounting face on an opposite side to the semiconductor package with respect to the first bonding member; and a second bonding member including a second glass transition temperature that is higher than the first glass transition temperature, the second bonding member disposed onto the mounting face to cover the electronic component.
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Explanation of Non-English Language Reference(s).
Notification of Reason for Refusal mailed by Japan Patent Office on Aug. 25, 2009 in the corresponding Japanese patent application No. 2008-255617.
Dinh Tuan T
Kabushiki Kaisha Toshiba
Knobbe Martens Olson & Bear LLP
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