Printed circuit board and electric device configured to facilita

Details Printed circuit board and electric device configured to facilita Printed circuit board and electric device configured to facilita

1992-09-29

1994-03-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361767, 361808, 361813, 174259, 174260, 257692, 257697, H05K 702

Patent

active

052913759

ABSTRACT:
A circuit board for mounting an electric device having a plurality of leads, the circuit board including an insulating substrate and a pad electrode formed on the insulating substrate, the pad electrode including an upper portion and a lower portion, and the lower being configured to be bonded to a lead portion. Also, an electric device mounted on a circuit board which has a plurality of pad electrodes each having a surface contacting the circuit board, the electric device including a package having a semiconductor device and a plurality of leads each having one end portion which is bonded to a corresponding pad electrode among the plurality of pad electrodes, at least three of the leads being longer than other ones of the leads, a bonding material filling a gap between each of the other leads and its corresponding pad electrode.

REFERENCES:
patent: 5093282 (1992-03-01), Ohno
IBM I Disclosure Bulletin, vol. 34, Aug. 1991, Integrated test via and pad design, pp. 361-362, No. 3.
IBM II Technical Disclosure Bulletin, Flexible film chip carrier with fine line capabilities, Sep. 1991, vol. 34, No. 4B, pp. 389-390.

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