Printed circuit board and a circuit assembly for a radio apparat

Details Printed circuit board and a circuit assembly for a radio apparat Printed circuit board and a circuit assembly for a radio apparat

1985-05-23

1988-04-05

Kee Chi, James

Electricity: electrical systems and devices

Miscellaneous

361414, H05K 900, H05K 111, H05K 114

Patent

active

047362669

ABSTRACT:
A printed circuit board comprises a baseboard having conductor patterns therein and ground layers on both surfaces thereof, and terminal pins mounted on the baseboard. The terminal pins have a root portion which does not project from the baseboard and a contact portion which projects from the baseboard. A circuit assembly comprises a mother printed circuit board, such as the above-mentioned printed circuit board, on which circuit modules are mounted. The circuit module has terminal jacks, which are enclosed within a shielded package and into which the terminal pins of the mother printed circuit board are connected by insertion.

REFERENCES:
patent: Re27089 (1971-03-01), Sears et al.
patent: 3346773 (1967-10-01), Lomerson
patent: 3459998 (1969-08-01), Focarile
patent: 3509624 (1970-05-01), Boncher
patent: 3568001 (1971-03-01), Straus
patent: 4339628 (1982-07-01), Marcantonio et al.
patent: 4386388 (1983-05-01), Beun
patent: 4477862 (1984-10-01), Gunzales
patent: 4514784 (1985-04-01), Williams et al.
Higgins, P. H. and Shabe, J. E., "Module Socket Pins with Insulating Sleeves", IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979.
Kin, Y. I., "Pin Attachment Structure for Multilayer Ceramic Substrates", IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978.

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