Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-05-02
2011-12-20
Norris, Jeremy (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S792000
Reexamination Certificate
active
08080741
ABSTRACT:
A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer.
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Japanese Office Action issued Jul. 6, 2010 in corresponding Japanese Patent Application 2008-110433.
Kang Myung Sam
Kim Chin Kwan
Norris Jeremy
Samsung Electro-Mechanics Co. Ltd.
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