Printed circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S262000

Reexamination Certificate

active

07544899

ABSTRACT:
In a printed circuit board on which a first conductor pattern, a second conductor pattern of smaller area than the first conductor pattern and electronic components are mounted, a gap between a first through-hole connected to the first conductor pattern and a first lead pin inserted therein is defined to be larger than that between a second through-hole connected to the second conductor pattern and a second lead pin. With this, it becomes possible to improve solder rise property, without increasing the number of electronic component production processes or degrading strength with respect to the electronic component.

REFERENCES:
patent: 3693052 (1972-09-01), Galanti
patent: 3747045 (1973-07-01), Stross
patent: 5371653 (1994-12-01), Kametani et al.
patent: 5726862 (1998-03-01), Huynh et al.
patent: 6071756 (2000-06-01), Sines et al.
patent: 0 621 747 (1994-10-01), None
patent: 04-144299 (1992-05-01), None
patent: 09-008443 (1997-01-01), None
patent: 2002-217533 (2002-08-01), None
patent: WO2005074338 (2005-08-01), None
patent: WO 2005/112531 (2005-11-01), None
Computer translation of Japanese Application Publication No. 09-008443.
United Kingdom Search Report dated Apr. 11, 2006.
Office Action dated Dec. 18, 2007 issued in corresponding Japanese Application No. 2004-357758.

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