Printed circuit board

Details Printed circuit board Printed circuit board

2011-06-07

2011-06-07

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C174S255000, C174S259000, C174S260000, C174S261000, C174S262000, C257S099000, C257S678000, C257S693000, C257S698000, C257S734000, C257S738000, C438S114000, C438S127000, C029S832000

Reexamination Certificate

active

07957157

ABSTRACT:
A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.

REFERENCES:
patent: 2008/0224309 (2008-09-01), Hori
patent: 10-093297 (1998-04-01), None
patent: 10-093297 (1998-04-01), None
patent: 11-177223 (1999-07-01), None
patent: 2005-347710 (2005-12-01), None
patent: 2006-278946 (2006-10-01), None
patent: 2006-278946 (2006-10-01), None
patent: 2008-060162 (2008-03-01), None
patent: 2008-226946 (2008-09-01), None
patent: 2008-226946 (2008-09-01), None
Notice of Reasons for Rejection mailed by Japan Patent Office on Jul. 13, 2010 in the corresponding Japanese patent application No. 2009-046798.

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