Printed circuit board

Details Printed circuit board Printed circuit board

2011-02-15

2011-02-15

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S296000, C257SE27016

Reexamination Certificate

active

07888803

ABSTRACT:
A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

REFERENCES:
patent: 6255157 (2001-07-01), Hsu et al.
patent: 7312146 (2007-12-01), Cheung et al.
patent: 7476922 (2009-01-01), Won et al.
patent: 11-307944 (1999-11-01), None
patent: 2005-191559 (2005-07-01), None

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