Printed circuit board

Details Printed circuit board Printed circuit board

1981-07-08

1983-11-01

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361400, 361409, 228180A, H05K 102

Patent

active

044133090

ABSTRACT:
A printed circuit board substrate is mounted with electric circuit components to form an electric circuit thereon. The printed circuit board is provided with a land without a piercing hole for electrical connection with an electrode of a chip-shaped leadless element, and a land with an aperture for the insertion of the lead wire of a component or element with a lead, and further a pilot pattern for leading melted solder in spite of the presence of evaporated solder flux gas or air during a solder dipping operation. The pilot pattern may comprise a conductive pattern connecting the land for the leadless element and the land for the element with lead. At least elimination of the solder resist layer on a portion of the conductive pattern to form the pilot pattern.

REFERENCES:
patent: 3431350 (1969-03-01), Haberecht
patent: 3610811 (1971-10-01), O'Keefe
patent: 3621116 (1971-11-01), Adams
patent: 3805117 (1974-04-01), Hausman
patent: 3859722 (1975-01-01), Kinsky et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4288840 (1981-09-01), Konishikawa et al.
patent: 4316320 (1982-02-01), Nogawa et al.
Allen et al., Solder Mask Process, IBM Tech. Disc. Bull., vol. 4 #2, Jul. 1961, p. 9.

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