Printed circuit board

Details Printed circuit board Printed circuit board

1985-04-01

1987-02-03

Grimley, Arthur T.

Stock material or miscellaneous articles

Composite

Of polyisocyanurate

174 685, 361397, 361414, 428901, B32B 2700

Patent

active

046408665

ABSTRACT:
A printed circuit board is provided comprising at least one layer of metal firmly bonded in laminar contact with at least one layer of solid, sintered polytetrafluoroethylene (PTFE). In one embodiment, the solid PTFE layer contains fibers of porous, expanded, sintered PTFE mixed within it. In another embodiment, the solid PTFE layer is firmly bonded to the metal layer on one side and is firmly bonded on the other side to a layer of porous, expanded, sintered PTFE.

REFERENCES:
patent: 2728698 (1955-12-01), Rudner
patent: 3421972 (1969-01-01), Cromwell et al.
patent: 3486961 (1969-12-01), Adams
patent: 4382236 (1983-03-01), Suzuki
patent: 4423282 (1983-12-01), Suzuki et al.
"Metal-Surfaced & Other Fluorocarbon Combinations", Electrical Manufacturing, Mar. 1952, pp. 106-110.

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