Printed circuit board

Details Printed circuit board Printed circuit board

1989-11-13

1991-05-21

Niebling, John F.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 428901, H05K 109, H05K 318

Patent

active

050177427

ABSTRACT:
A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The metal sulfide is of a metal that would be catalytic to electroless metal deposition. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating. In a preferred embodiment through holes in the circuit board substrate have their walls coated with a metal adhered to the plastic surface of the hole wall through an intermediate layer of tin-palladium sulfide.

REFERENCES:
patent: 844304 (1907-02-01), Daly
patent: 3011920 (1961-12-01), Shipley
patent: 3523875 (1970-08-01), Minklei
patent: 3533918 (1970-10-01), Smith
patent: 3682786 (1972-08-01), Brown et al.

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