Printed circuit board

Details Printed circuit board Printed circuit board

1995-04-12

1997-12-02

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

H01L 2158, H05K 334

Patent

active

056926693

ABSTRACT:
A printed circuit board comprising a plurality of lands onto which a plurality of leads of an electronic component are soldered. These lands are arrayed in parallel one another. Each of these lands includes a narrow portion basically extending in a longitudinal direction thereof and having a predetermined constant width, and a wide portion protruding laterally from both edges of the narrow portion.

REFERENCES:
patent: 3033914 (1962-05-01), Acosta-Lleras
IBM Technical Disclosure Bulletin vol. 34, No. 1, Jun. 1991 pp. 465-466.

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