Printed circuit base board and method for manufacturing same

Details Printed circuit base board and method for manufacturing same Printed circuit base board and method for manufacturing same

1975-08-12

1977-06-14

Ansher, Harold

Stock material or miscellaneous articles

Composite

Of epoxy ether

156230, 156241, 156249, 156330, 156331, 156335, 428435, 428436, 428442, 428506, 428522, 428524, B32B 2738, B32B 1704, B32B 2742, B32B 2734

Patent

active

040298450

ABSTRACT:
A base board for printed circuits prepared by the additive process, obtained by heating under pressure a layer comprising at least one sheet of prepreg comprising a thermosetting resin as impregnant and a layer of composition comprising a semi-cured thermosetting resin and a nitrile rubber, said layer of composition being placed on one or both sides of said prepreg layer to integrate said layers as a finished laminate. This base board is used in the additive process for manufacturing a printed circuit board having favorable properties with strong adhesion between the circuit and the base board without showing any warp or twist.

REFERENCES:
patent: 3240647 (1966-03-01), Morgan
patent: 3285802 (1966-11-01), Smith et al.
patent: 3737339 (1973-06-01), Alsberg et al.
patent: 3741858 (1973-06-01), Fujiwara et al.
patent: 3925138 (1975-12-01), Shaul et al.
patent: 3936575 (1976-02-01), Watanabe et al.
patent: 3972765 (1976-08-01), Kondo et al.

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