Printed circuit assembly with contact dot

Details Printed circuit assembly with contact dot Printed circuit assembly with contact dot

1989-08-21

1993-02-23

Reynolds, Bruce A.

Electric heating

Metal heating

Wire, rod, or bar bonding

29846, 29879, B23K 1116, H01R 4302

Patent

active

051892758

ABSTRACT:
A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.

REFERENCES:
patent: 3114828 (1963-12-01), Gannoe
patent: 3257707 (1966-06-01), Hotine et al.
patent: 3382575 (1968-05-01), Gannoe
patent: 3803711 (1974-04-01), Dubuc et al.
patent: 4403411 (1983-09-01), Patton

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