Printed circuit assembly having improved reference plane isolati

Details Printed circuit assembly having improved reference plane isolati Printed circuit assembly having improved reference plane isolati

1994-12-22

1996-06-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361796, 361800, 361792, 361816, 174 35R, 257659, H05K 900

Patent

active

055239218

ABSTRACT:
A printed circuit assembly (PCA) having improved reference plane isolation for reducing electromagnetic and communication Input/Output (I/O) emissions includes a reference plane layer having a plurality of apertures patterned therein. A component layer of the PCA I/O communication circuitry and non I/O circuitry thereon. In the preferred embodiment, the apertures are aligned in a double row of substantially single file patterns on the reference plane. The single file patterns are positioned substantially parallel to and adjacent each other. Also, each aperture in each single file pattern is offset staggered with respect to a corresponding aperture in the adjacent single file pattern. When the reference plane layer and component layer are disposed in the PCA, the patterned apertures are placed relative to the component layer in a manner such that they substantially separate the non I/O circuitry from the I/O communication circuitry for reducing I/O communication emissions. In an alternate embodiment, the apertures are aligned in an individual, substantially single file pattern on the reference plane.

REFERENCES:
patent: 4954929 (1990-09-01), Baran
patent: 5119047 (1992-06-01), Brown et al.
patent: 5165055 (1992-11-01), Metsler

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