Printed circuit assembly

Details Printed circuit assembly Printed circuit assembly

2011-07-05

2011-07-05

Duverne, Jean F (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

Reexamination Certificate

active

07972143

ABSTRACT:
A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.

REFERENCES:
patent: 4017135 (1977-04-01), Taguchi
patent: 4494818 (1985-01-01), Petersen et al.
patent: 4815979 (1989-03-01), Porter
patent: 5217383 (1993-06-01), Hildebrandt et al.
patent: 5317477 (1994-05-01), Gillett
patent: 5365403 (1994-11-01), Vinciarelli et al.
patent: 5511984 (1996-04-01), Olson et al.
patent: 5661901 (1997-09-01), King
patent: 5697800 (1997-12-01), Aramizu
patent: 5754411 (1998-05-01), Woychik
patent: 5924876 (1999-07-01), Beamenderfer et al.
patent: 6171139 (2001-01-01), Sato et al.
patent: 6206713 (2001-03-01), Baertsoen et al.
patent: 6244881 (2001-06-01), Hara
patent: 6280201 (2001-08-01), Morris
patent: 6320759 (2001-11-01), Tusan et al.
patent: 6345990 (2002-02-01), Hyzin
patent: 6435892 (2002-08-01), Billman
patent: 6460170 (2002-10-01), Shaeffer et al.
patent: 6736647 (2004-05-01), Gillenberg
patent: 6837741 (2005-01-01), Kuwahara
patent: 6932617 (2005-08-01), Debord et al.
patent: 7252537 (2007-08-01), Simon et al.
patent: 7364461 (2008-04-01), Back et al.
patent: 2002/0004323 (2002-01-01), Azuma
patent: 2003/0014728 (2003-01-01), Shaeffer et al.
patent: 2003/0117129 (2003-06-01), Parrish
patent: 2006/0128174 (2006-06-01), Jang et al.
patent: 578 300 (1976-07-01), None
patent: 137 305 (1979-08-01), None
patent: 0 786 856 (1997-07-01), None
patent: 1256332 (1971-12-01), None
patent: 7057832 (1995-03-01), None
patent: 9298360 (1997-11-01), None
patent: WO 96/08415 (1996-03-01), None
patent: WO 98/35821 (1998-08-01), None
patent: WO 99/44260 (1999-09-01), None
International Search Report for International Application No. PCT/US2010/000277.

Affiliated with

Also associated with

Rating

Printed circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2647837