Printed circuit and method of forming same

Details Printed circuit and method of forming same Printed circuit and method of forming same

1982-02-08

1983-08-30

Smith, John D.

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

427 541, 427 96, 427 97, 427 99, 427199, 427259, H05K 312, H05K 314

Patent

active

044016867

ABSTRACT:
An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.

REFERENCES:
patent: 3516855 (1970-06-01), Goll
patent: 3699027 (1972-10-01), Miller
patent: 4049844 (1977-09-01), Bolon
patent: 4152195 (1979-05-01), Bahrle
patent: 4157407 (1979-06-01), Peiffer
patent: 4280888 (1981-07-01), Bush
patent: 4303698 (1981-12-01), Beske
patent: 4327124 (1982-04-01), Des Marais

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