Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-10-20
2010-06-08
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S081000, C439S080000, C439S083000
Reexamination Certificate
active
07731504
ABSTRACT:
A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
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Kiyoshi Takagi, “Build-Up Multilayer Printed Wiring Board Technologies”, Nikkan kougyou shinbunsya, Jun. 20, 2000, pp. 67-73, 75-83, two cover pages and two end pages (with Partial English Translation).
Furutani Toshiki
Kariya Takashi
Kawanishi Takeshi
Ibiden Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Paumen Gary F.
LandOfFree
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