Printed board

Details Printed board Printed board

2005-05-23

2008-03-11

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S772000, C361S776000

Reexamination Certificate

active

07342182

ABSTRACT:
A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of the conductor pattern forming the pad is smaller than an area determined based on the circumference of the conductor pattern that forms the pad.

REFERENCES:
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patent: 6217990 (2001-04-01), Asai et al.
patent: 6700204 (2004-03-01), Huang et al.
patent: 2002/0016090 (2002-02-01), Haba et al.
patent: 2002/0084105 (2002-07-01), Geng et al.
patent: 2002/0125043 (2002-09-01), Yoshida
patent: 2003/0020178 (2003-01-01), Ohashi et al.
patent: 61-158198 (1986-07-01), None
patent: 6-13181 (1994-02-01), None
patent: 2004-039732 (2004-02-01), None

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