Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2006-04-04
2006-04-04
Kopec, Mark (Department: 1751)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S513000, C252S514000, C252S518100, C427S096400, C148S024000, C148S025000
Reexamination Certificate
active
07022266
ABSTRACT:
A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like. The composition includes the following components: (a) a metal powder, (b) a solder powder, (c) a polymer or a monomer which is polymerisable to yield a polymer, wherein the polymer is cross-likable under the action of a chemical cross-linking agent, and (d) a chemical cross-linking agent for the polymer, the cross-linking agent having fluxing properties and being unreactive with the polymer without catalysis. The polymer will generally be an epoxy resin and the cross-linking agent will generally be a polyacid. The composition preferably is one in which the metal powder and/or solder powder generates and/or has adhered thereto a catalyst for the cross-linking agent which is liberated on application of heat.
REFERENCES:
patent: 3915729 (1975-10-01), Eustice
patent: 4663079 (1987-05-01), Yamaguchi et al.
patent: 5376403 (1994-12-01), Capote et al.
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patent: 95/13901 (1995-05-01), None
patent: 96/13041 (1996-05-01), None
patent: 96/22670 (1996-07-01), None
patent: 96/30966 (1996-10-01), None
Dow Corning Corporation
Hamlin Derrick G.
Kopec Mark
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