Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1998-05-27
2000-09-12
Elms, Richard
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438313, 437 96, H01L 2144
Patent
active
061177067
ABSTRACT:
The printed circuit board comprises a substrate 1 including a part loading portion 3 into which an electronic part 5 can be loaded, a plurality of contact terminals 2 which are respectively formed on one surface of the substrate 1 and the surfaces of which are exposed to the outside to provide external contacts, and openings 4 respectively formed in the other surface of the substrate 1 for insertion of bonding wires 6 which are used to connect the electronic part 5, which are to be loaded into the part loading portion 3 of the substrate 1, to its associated contact terminals 2. In the printed circuit board, each of the contact terminals 2 is formed of a metal foil 9 directly and closely attached to the substrate 1. This can prevent the lowered heat resistance of a printed circuit board which occurs when the metal foil, which is used to form the contact terminals 2, is bonded to the substrate 1 using an adhesive.
REFERENCES:
patent: 5219607 (1993-06-01), Lawakami et al.
patent: 5357674 (1994-10-01), Lumbard
patent: 5494781 (1996-02-01), Ohtani et al.
Tanaka Ken'ichiro
Tatsuta Jun
Yoshida Norio
Yoshioka Hirokazu
Elms Richard
Luu Pho
Matsushita Electric & Works Ltd.
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