Primer composition used for adhesion

Details Primer composition used for adhesion Primer composition used for adhesion

1982-02-25

1983-08-30

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

10628711, 10628714, 10628715, 10628716, 156314, 156326, 156329, 427409, 428447, 524588, C09J 502

Patent

active

044015003

ABSTRACT:
A mixture of an alkoxy containing silicon compound, a hydroperoxide, and organic solvent is a primer composition useful for bonding heat curing silicone rubber, especially fluorosilicone rubber, to a substrate.

REFERENCES:
patent: 3849148 (1974-11-01), Temple
patent: 4059473 (1977-11-01), Okami
patent: 4133938 (1979-01-01), Bingham

Affiliated with

Also associated with

Rating

Primer composition used for adhesion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Primer composition used for adhesion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Primer composition used for adhesion will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-904717