Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-06-24
1999-09-21
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361813, 361772, 361807, 361809, 361764, 257690, 257692, 257735, 257782, 174 521, H05K 118
Patent
active
059562374
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to primary printed wiring boards from which secondary printed wiring boards (hereinafter referred to as "printed wiring boards" or "desired printed wiring board", when applicable) are obtained, and more particularly to a primary printed wiring board with which electronic components can be inspected readily and positively.
RELATED ART
In a conventional primary printed wiring board, as shown in FIG. 14, a plurality of (eight) auxiliary plated leads (43, 44, and so on) are connected to contact terminals (33, 34 and so on) forming a predetermined contact pattern P, and further connected collectively to the collecting parts 51a of a main plated lead 5. FIG. 15 shows another conventional primary printed wiring board comprising a substrate 1 on which a plurality of leads (61 and so on) are formed. The free ends (611 etc.) of those leads are connected to an electronic component 10 which is mounted on the board. The auxiliary plated leads (41 etc.) are connected to the other ends 62 of lead 61. The auxiliary plated leads are collectively connected to four collecting parts (51) of the main plated leads 5a and 5b, and the leads are electrically connected to one another (see Examined Japanese Patent Application Publication No. 14225/1992).
The collecting parts 51 are formed by blanking (cutting material using a die). at 52a as shown in FIG. 16. Hence, the auxiliary plated leads are separated from one another, and contact terminals forming adjacent contact patterns or lead patterns (P.sub.1 and P.sub.2), or the auxiliary plated leads connected to the main leads, are also electrically isolated from one another. A testing contactor is brought into contact with the contact terminals or leads, so as to determine whether or not the electrical component is satisfactory as is well known in the art (see Examined Japanese Patent Application Publication No. 14225/1992).
However, the above-described conventional printed wiring board suffers from the following difficulties: (1) In order to form openings by blanking, it is necessary to provide a metal die for every contact pattern, which results in an increase in manufacturing cost. (2) Being formed by blanking, the resultant products (printed wiring boards) are liable to be cracked or dented. That is, the blanking operation is one of the factors which adversely affect the products. (3) The blanking operation is carried out in the final stage where the product is highest in value added, and therefore the potential loss is greatest at this stage.
An object of the invention is to solve the above described problems associated with a conventional primary printed wiring board. More specifically, an object of the invention is to provide a primary printed wiring board which is advantageous as follows: It can be manufactured without use of a tool for insulation and isolation; that is, it can be formed independently of various specific contact patterns (layouts), so that the printed wiring board is less damaged when compared with the conventional one. The pattern forming effective area is wide, and the main plated leads can use common leads, and the electrical components mounted on the board can be inspected readily and positively.
BRIEF SUMMARY OF THE INVENTION
A primary printed wiring board according to the invention comprises: secondary printed wiring boards arranged in plural lines; main plated leads formed between the plural lines of secondary printed wiring boards; and auxiliary plated leads which connect patterns forming the secondary printed wiring boards to the main plated leads.
In the primary printed wiring board according to the invention, each main plated lead is zigzagged to provide "forward" or proximal lines and "backward" or distal lines which are laid respectively on both sides of a predetermined cutting line with respect to the contact pattern, and the auxiliary plated leads are connected to the backward lines.
A primary printed wiring board according to the invention also comprises: a printed wiring board substrate; at least
REFERENCES:
patent: 3821847 (1974-07-01), Melse et al.
patent: 4134801 (1979-01-01), Hofer et al.
patent: 5036380 (1991-07-01), Chase
patent: 5274197 (1993-12-01), Kondo et al.
patent: 5389739 (1995-02-01), Mills
Horiba Yasuhiro
Kato Hisao
Kohmura Toshimi
Foster David
Ibiden Co. Ltd.
Picard Leo P.
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