Special receptacle or package – With ornamentation or simulation
Reexamination Certificate
2003-01-17
2003-12-30
Bui, Luan K. (Department: 3728)
Special receptacle or package
With ornamentation or simulation
C206S459500, C206S497000, C040S312000
Reexamination Certificate
active
06669021
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates to a prewrapped gift package, and in particular, to a prewrapped gift package which can accommodate different categories of gifts.
During gift giving occasions such as Christmas, birthdays, Mother's Day, and Father's Day, a laborious and time consuming chore is the wrapping of a gift. Many retail establishments offer to gift wrap packages for their customers. However, when it is a gift giving season such as Christmas, the lines to obtain gift wrapping from a retail establishment are long and there is usually an extra charge to have a package gift wrapped.
Accordingly, it is an object of the present invention to provide a prewrapped gift package.
SUMMARY OF THE INVENTION
The foregoing object and other objects of the invention are attained in a prewrapped gift package comprising a carton for holding the gift. Wrapping paper overlays an outer surface of the carton. A sleeve providing indicia identifying the gift is affixed to a portion of the wrapping paper. A protective outer wrap surrounds the carton, wrapping paper and sleeve. The invention also includes a method of forming a prewrapped gift package comprising the steps of forming the carton to hold a gift, placing gift-wrapping paper about the outer surface of the carton, placing a sleeve providing identifying indicia for the gift about a portion of the outer surface of the gift wrapping paper and then placing a protective outer wrap about the carton, wrapping paper and sleeve.
REFERENCES:
patent: 4726509 (1988-02-01), Fonas
patent: 5251759 (1993-10-01), Gannon et al.
patent: 5392983 (1995-02-01), Clarke-Bolling et al.
patent: 5490597 (1996-02-01), Schluger
patent: 6347703 (2002-02-01), Betts
patent: 6405869 (2002-06-01), Whittemore et al.
Bui Luan K.
Deutsch Barry E.
HP Intellectual Corp.
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