Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2007-01-30
2007-01-30
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S459000, C438S406000
Reexamination Certificate
active
10686082
ABSTRACT:
A preventive treatment method for a multilayer semiconductor structure having a support substrate, at least one intermediate layer and a surface layer in which the surface layer is to be subjected to a subsequent chemical treatment. The method includes forming a protective layer between the intermediate layer and the surface layer. The protective layer is made from a material chosen to be sufficiently resistant to the chemical treatment to protect the intermediate layer from chemical attack.
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Ghyselen Bruno
Rayssac Olivier
S.O.I.Tec Silicon on Insulator Technologies S.A.
Schillinger Laura M.
Winston & Strawn LLP
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