Preventing lateral oxide growth by first forming nitride layer f

Metal treatment – Compositions – Heat treating

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29571, 29576B, 148175, 148187, 357 51, 357 91, H01L 2122, H01L 21265

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045643946

ABSTRACT:
A limit is placed on the miniaturization of the field oxide structures in the manufacture of semiconductor layer arrangements due to the length of the thick oxide bird's beak. The diffusion of oxidizing agent is suppressed according to the invention by means of a thin diffusion barrier of silicon nitride which also produces no crystal faults in the desired temperature range. The natural oxide on the silicon wafers is also converted into a diffusion barrier as required by means of nitrogen implantation and/or special process management in the nitride deposition.

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