Pretreatment process for electroless plating of polyimides

Details Pretreatment process for electroless plating of polyimides Pretreatment process for electroless plating of polyimides

1989-10-03

1993-01-12

Beck, Shrive

Stock material or miscellaneous articles

Composite

Of metal

427304, 427305, 427306, C23C 2600

Patent

active

051789566

ABSTRACT:
A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

REFERENCES:
patent: 3445350 (1969-05-01), Klinger et al.
patent: 3574070 (1971-04-01), Sahely
patent: 3668130 (1972-06-01), Kadison
patent: 3689303 (1972-09-01), Maguire et al.
patent: 3881049 (1975-04-01), Brandt
patent: 3959531 (1976-05-01), Schneble
patent: 3963590 (1976-06-01), Deyrup
patent: 4042729 (1977-08-01), Polichette
patent: 4063004 (1977-12-01), Quinn
patent: 4515829 (1985-05-01), Deckert
patent: 4552626 (1985-11-01), Stevenson
patent: 4552787 (1985-11-01), Chebiniak
patent: 4594311 (1986-06-01), Frisch et al.
patent: 4775449 (1988-10-01), Dumas et al.

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