Pretreatment of an epoxy resin substrate for electroless copper

Details Pretreatment of an epoxy resin substrate for electroless copper Pretreatment of an epoxy resin substrate for electroless copper

1979-12-13

1981-11-10

Smith, John D.

Coating processes

Restoring or repairing

156632, 156666, 156668, 427 98, 427142, 427304, 427305, 427306, 427307, C23C 302

Patent

active

042998638

ABSTRACT:
The pretreatment of an epoxy resin substrate for electroless copper plating comprises the steps of subjecting the epoxy resin substrate to a treatment with an aqueous solution including a chloride of iron and then subjecting the substrate to a treatment with an aqueous solution of a water soluble peroxide before sensitizing the epoxy resin substrate for electroless copper plating.

REFERENCES:
patent: Re28042 (1974-06-01), Rhodenizer et al.
patent: 3728177 (1973-04-01), Caule
patent: 3758332 (1973-09-01), Dinella et al.
patent: 3808028 (1974-04-01), Lando
patent: 3864147 (1975-02-01), Grunwald et al.
patent: 3892635 (1975-07-01), Mallico
patent: 4086128 (1978-04-01), Sugio et al.
Takagi, Kiyoshi, "Metal Surface Technique", vol. 23, No. 8 pp. 39-45 and vol. 23, No. 9, pp. 40-48 (1972) published by Metal Surface Technique Society of Japan.

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