Pretreatment composition and process for tin-lead immersion plat

Details Pretreatment composition and process for tin-lead immersion plat Pretreatment composition and process for tin-lead immersion plat

1990-06-04

1992-04-14

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427436, 427128, C23C 200

Patent

active

051046881

ABSTRACT:
Metallic surfaces to be provided with a tin-lead coating from an immersion tin-lead bath, and particularly copper surfaces (e.g., through-holes, pads) of a printed circuit board having other metallic surfaces thereon covered by a hydrophobic solder mask, are prepared for receipt of immersion tin-lead coating by, e.g., contact thereof with a strongly acidic aqueous pre-dip solution containing at least one surface active agent functional to reduce the surface tension of the pre-dip solution and/or to provide the solution with improved affinity for the metallic surface.

REFERENCES:
patent: 4027055 (1977-05-01), Schneble
patent: 4160049 (1979-07-01), Narcus
patent: 4169171 (1979-09-01), Narcus
patent: 4194913 (1980-03-01), Davis
patent: 4234631 (1980-11-01), Davis
patent: 4301190 (1981-11-01), Feldstein
patent: 4321285 (1982-03-01), Feldstein
patent: 4368107 (1983-01-01), Maejima
patent: 4564424 (1986-01-01), Cassat
patent: 4581256 (1986-04-01), Sommer
patent: 4617205 (1986-10-01), Darken
patent: 4666735 (1987-05-01), Hoover
A. F. Schmeckenbecker "Immersion Tin-Lead Plating", IBM Technical Disclosure Bulletin, vol. 18, No. 7, Dec. 1975, p. 2167.

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