Pressurized oxygen for evaluation of molding compound...

Chemistry: analytical and immunological testing – Process or composition for sterility or package integrity test

Reexamination Certificate

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C436S103000, C436S127000

Reexamination Certificate

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07442552

ABSTRACT:
A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

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patent: 2003-40609 (2003-02-01), None

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