Pressurized oxygen for evaluation of molding compound...

Chemistry: analytical and immunological testing – Process or composition for sterility or package integrity test

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C436S103000, C436S127000

Reexamination Certificate

active

10658859

ABSTRACT:
A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

REFERENCES:
patent: 3421856 (1969-01-01), Stenger et al.
patent: 3578756 (1971-05-01), Evans et al.
patent: 3820379 (1974-06-01), Nelson et al.
patent: 4758408 (1988-07-01), Krawetz et al.
patent: 4942750 (1990-07-01), Conaway
patent: 4990312 (1991-02-01), Rucker et al.
patent: 6858300 (2005-02-01), Kinose et al.
patent: 7098276 (2006-08-01), Kiuchi et al.
patent: 2003-40609 (2003-02-01), None
Nikkei Electronics Oct. 21, 2002, 23 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pressurized oxygen for evaluation of molding compound... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressurized oxygen for evaluation of molding compound..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressurized oxygen for evaluation of molding compound... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3837340

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.