Pressure welding bonding apparatus

Metal fusion bonding – Means to bond by applying only pressure

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Details

228 41, 228221, B23K 2000

Patent

active

047098449

ABSTRACT:
The bonding apparatus has a holding device, a pressing device for pressure welding substances to be bonded to each other, and a superhigh vacuum bonding chamber provided with the holding device and the pressing device. A superhigh vacuum bonding preparatory chamber is connected with the superhigh vacuum bonding chamber through a gate valve and a conveyor is arranged for conveying the substances to be bonded between the superhigh vacuum bonding preparatory chamber and the superhigh vacuum bonding chamber. The preparatory chamber is provided with a rotary preparatory table having a plurality of stages for releasably supporting holders for holding the substances to be bonded, the preparatory table being moved to successive positions to register with the conveyor.

REFERENCES:
patent: 4166563 (1979-09-01), Peyraud

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