Pressure-welded structure of flexible circuit boards

Details Pressure-welded structure of flexible circuit boards Pressure-welded structure of flexible circuit boards

2005-10-04

2005-10-04

Chowdhury, Tarifur R. (Department: 2871)

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

C349S149000, C349S151000, C349S152000

Reexamination Certificate

active

06952250

ABSTRACT:
A pressure-welded structure of flexible circuit boards in a liquid crystal display device having a group of lead terminals of flexible circuit boards connected with a plurality of terminals aligned on an end surface of a TFT glass substrate via anisotropic conductive films. A resin is applied on a surface opposite to the terminal surface of the flexible circuit boards, and an end portion of the resin is 0.1 to 10 mm away from an end portion of a resin applied on the terminal surface of the flexible circuit boards, thereby both resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm. It is possible to improve not only the yield in module assembly but also the quality and reliability of the product.

REFERENCES:
patent: 5672400 (1997-09-01), Hansen et al.
patent: 5949512 (1999-09-01), Taguchi
patent: 6086441 (2000-07-01), Akiguchi et al.
patent: 6211469 (2001-04-01), Taguchi
patent: 6424400 (2002-07-01), Kawasaki
patent: RE37945 (2002-12-01), Kanezawa
patent: 10-123 555 (1998-05-01), None
Patent Abstracts of Japan, English abstract of JP 10-123 555-A, Nomura+/Matsushita (2 pp., ©1998, Japan Patent Office).
Six-page English partial translation of JP Unexamined Patent Publication 123,555/1998.

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