Pressure switch employing silicon on insulator (SOI) technology

Electricity: circuit makers and breakers – Multiple circuit control – Sequential operations

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C200S512000

Reexamination Certificate

active

07964807

ABSTRACT:
A pressure switch employs semiconductor silicon on insulator (SOI) technology and utilizes a first silicon wafer with a deflecting diaphragm having two metal contacts deposited thereon. Secured to the silicon wafer is a glass wafer having a central aperture defining a deflecting region. Positioned on the glass wafer is third metal contact positioned to receive the two contacts deposited on the silicon wafer when a predetermined pressure is applied. As predetermined pressure is applied, the contacts on the silicon wafer will touch the contact on the glass wafer and a connection will be made between the silicon wafer contacts to create a low impedance path between the two contacts.

REFERENCES:
patent: 5286671 (1994-02-01), Kurtz et al.
patent: 6194678 (2001-02-01), Yoshikawa et al.
patent: 6272928 (2001-08-01), Kurtz
patent: 6639165 (2003-10-01), Newman et al.
patent: 6670562 (2003-12-01), Kaneko
patent: 7178403 (2007-02-01), Kurtz
patent: 2001/0025778 (2001-10-01), Ono
patent: 2007/0221488 (2007-09-01), Shin et al.
patent: 2007/0254796 (2007-11-01), Kurtz et al.
patent: 2009/0078547 (2009-03-01), Kurtz et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pressure switch employing silicon on insulator (SOI) technology does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure switch employing silicon on insulator (SOI) technology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure switch employing silicon on insulator (SOI) technology will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2681648

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.