Pressure sintering method for fastening electronic components on

Details Pressure sintering method for fastening electronic components on Pressure sintering method for fastening electronic components on

1996-09-10

1999-04-13

Ryan, Patrick

Metal fusion bonding

Process

Diffusion type

228193, 228208, B23K 2016

Patent

active

058935118

ABSTRACT:
In a method for fastening electronic components on a substrate by means of pressure sintering, which includes providing a layer of sinterable metal powder on a surface of one component, assembling the components engaging the layer and then, while exerting a pressure on the components, applying heat to sinter the layer of material, an improvement comprises forming the layer of sinterable metal powder by vaporizing a metal and condensing the metal as a nanocrystalline metal powder on the surface. Preferably, the metal powder is silver and is applied in a precipitation chamber.

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patent: 4844323 (1989-07-01), Kondo et al.
patent: 4903885 (1990-02-01), Schwarzbauer
patent: 4903886 (1990-02-01), Schwarzbauer
Eifert et al, "Preparation and DC-Properties of Nanporous Metal Networks", Int. J. Electronics, vol. 73, No. 5, pp. 945-947.
Granqvist et al, "Ultrafine Metal Particles", Journal of Applied Physics, vol. 47, No. 5, May 1976, pp. 2200-2219.

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