Pressure sensor with single deposit adhesive

Details Pressure sensor with single deposit adhesive Pressure sensor with single deposit adhesive

2006-08-08

2006-08-08

Thompson, Jewel V. (Department: 2855)

Measuring and testing

Fluid pressure gauge

Electrical

Reexamination Certificate

active

07086290

ABSTRACT:
Pressure sensor methods and systems are disclosed. In general, two micromachined die and a diaphragm for a pressure sensor can be provided. The two micromachined die can be embedded in a glass adhesive on a surface of the diaphragm, such that the glass adhesive possesses a large size relative to the two micromachined die. The large size of the glass adhesive creates a large planar target for placement of the two micromachined die upon the diaphragm, thereby providing a size difference between the glass adhesive and the two micromachined die thereby creates an optimum strain transfer, while maintaining stability for the pressure sensor.

REFERENCES:
patent: 5465626 (1995-11-01), Brown et al.
patent: 6247369 (2001-06-01), Chapman et al.
patent: 6422206 (2002-07-01), Wade et al.
patent: 6536287 (2003-03-01), Beekhuizen et al.
patent: 6722205 (2004-04-01), Bodin
patent: 6742397 (2004-06-01), Parker
patent: 6881648 (2005-04-01), Chen et al.

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