Pressure sensor with improved heat dissipation characteristics

Details Pressure sensor with improved heat dissipation characteristics Pressure sensor with improved heat dissipation characteristics

1993-03-09

1994-07-12

Woodiel, Donald

Measuring and testing

Fluid pressure gauge

Mounting and connection

296211, 73721, 73727, 338 4, C01L 708, C01L 906

Patent

active

053277856

ABSTRACT:
A pressure sensor is provided with a means for efficiently removing heat from a circuit portion of a sensor die by providing an elastomeric member between a first surface of the sensor die and electrical leads. A thermally conductive, but electrically insulative, portion of the elastomeric member is disposed between the circuit portion of the sensor die and the leads and a means is provided for urging the first surface of the sensor die into thermal communicating contact with the thermally conductive portion of the elastomeric member. In addition, a selectively conductive portion of the elastomeric member is disposed between contact pads on the first surface of the sensor die and electrical leads encapsulated within a portion of the sensor housing. The elastomeric member is also provided with an opening formed therethrough and aligned with the diaphragm portion of the sensor die to permit the media to be in fluid communication with the diaphragm of the sensor die. The improved sensor die arrangement provided by the present invention can be adapted for use in either an absolute pressure sensing embodiment or a differential pressure sensing embodiment.

REFERENCES:
patent: 4656454 (1987-04-01), Rosenberger
patent: 5060527 (1991-10-01), Burgess
patent: 5184107 (1993-02-01), Maurer
Article dated Dec. 4, 1972 in Electronics Magazine entitled "Integration Brings a Generation of Low-Cost Transducers" by Ziss and Hare.

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