Pressure sensor with high modules support

Details Pressure sensor with high modules support Pressure sensor with high modules support

1991-03-29

1992-10-27

Woodiel, Donald O.

Measuring and testing

Fluid pressure gauge

Diaphragm

29 2541, 73724, 361283, G01L 708, G01L 912

Patent

active

051579723

ABSTRACT:
A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.

REFERENCES:
patent: 4833920 (1989-05-01), Knecht et al.
patent: 4905575 (1990-03-01), Knecht et al.

Affiliated with

Also associated with

Rating

Pressure sensor with high modules support does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure sensor with high modules support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure sensor with high modules support will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-899449