Pressure sensor package for reducing stress-induced measurement

Details Pressure sensor package for reducing stress-induced measurement Pressure sensor package for reducing stress-induced measurement

1994-06-13

1995-08-08

Chilcot, Jr., Richard E.

Measuring and testing

Fluid pressure gauge

Mounting and connection

73716, 7386371, 73727, G01L 700

Patent

active

054388775

ABSTRACT:
A pressure sensor package (10) has a sensor body (12) for containing a pressure sensor. An elongated stem (14) has a first end connected to the sensor body (12), and a connector (24, 26) is disposed on a second end of the stem (14) for fixedly mounting the stem (14) to a mounting base (40), which is connected to, for example, a fuel tank (52). An annular sealing surface (28) is disposed on the first end of the stem (14) for pressing against a compressible seal (44) when the stem (14) is mounted to the mounting base (40), and an orifice (18) is disposed at the second end of the stem (14). The orifice 18 is connected to the pressure sensor by a passage (20, 22) through the stem body. The connector (24, 26) is spaced a sufficient distance from the sensor body (12) to substantially reduce error-inducing stresses on the pressure sensor.

REFERENCES:
patent: 4984468 (1991-01-01), Hafner
patent: 5257547 (1993-11-01), Boyer
patent: 5317924 (1994-06-01), Maack
patent: 5333507 (1994-08-01), Vogler et al.
patent: 5351550 (1994-10-01), Maurer

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