Pressure sensor package and electronic part

Details Pressure sensor package and electronic part Pressure sensor package and electronic part

2008-07-17

2009-06-23

Allen, Andre J (Department: 2855)

Measuring and testing

Fluid pressure gauge

Electrical

C257S678000

Reexamination Certificate

active

07549344

ABSTRACT:
A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D1of the semiconductor substrate, a thickness D2of the diaphragm section, a thickness D3of the cavity, and a thickness D4=D1−(D2+D3) satisfy the relationships: (D2+D3) in a range of approximately 5-20 μm, and D1not less than about 100 μm.

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S. Armbruster et al., “A Novel Micromachining Process for the Fabrication of Monocrystalline SI-Membranes Using Porous Silicon”, Digest of Technical Papers Transducers, Mar. 2003, pp. 246-249.

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