Pressure sensor package

Details Pressure sensor package Pressure sensor package

1991-06-19

1992-06-30

Woodiel, Donald O.

Measuring and testing

Fluid pressure gauge

Mounting and connection

73706, 73721, 73727, 338 4, G01L 708, G01L 906

Patent

active

051252759

ABSTRACT:
A pressure sensor package, having a dual-in-line package (DIP) structure as commonly used in the semiconductor industry, comprises a first layer of predetermined material, having at least one internal passage for transmitting a fluid under pressure from a first surface of the first layer to a second surface of the first layer. A pressure sensitive element is bonded to the first surface of the first layer, and covers an exit from the first surface of the internal passage. A lead package, has a plurality of pins, each pin being perpendicular to the first surface of the first layer and placed along a first and second length of the first layer exterior to the pressure sensor package, and having a spacing conforming to the DIP configuration. Predetermined points of the pressure sensitive element are electrically connected to predetermined pins. A second layer of predetermined material is bonded to the first surface of the first layer providing an enclosed spaced for the pressure sensitive element.

REFERENCES:
patent: 4295117 (1981-10-01), Lake et al.
patent: 4592229 (1986-06-01), Butefisch et al.

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