Pressure sensor housing and configuration

Details Pressure sensor housing and configuration Pressure sensor housing and configuration

2006-11-08

2009-10-06

Thompson, Jewel (Department: 2855)

Measuring and testing

Fluid pressure gauge

Mounting and connection

Reexamination Certificate

active

07597005

ABSTRACT:
A pressure sensor housing and configuration is provided for a single-square-sensor (SSS) sensing die. A sensor includes a glass wafer hermetically bonded to the SSS chip. The SSS chip is then positioned between a header and a cover, which can be glued together using an epoxy, for example. A tube, such as a pyrex tube, is connected to the SSS chip through which pressure is sensed. After bonding the wafer to the SSS chip, a vacuum seal is created and thus less emphasis is placed on hermetically sealing the remainder of the sensor.

REFERENCES:
patent: 3123788 (1964-03-01), Pfann et al.
patent: 4321832 (1982-03-01), Runyan
patent: 4683755 (1987-08-01), Samek
patent: 4739381 (1988-04-01), Hideo et al.
patent: 5459351 (1995-10-01), Bender
patent: 7278319 (2007-10-01), Johnson
patent: 2003/0167851 (2003-09-01), Parker
patent: WO9429685 (1994-12-01), None
patent: WO2005103639 (2005-11-01), None

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