Pressure sensor having improved arrangement of sensor chip...

Measuring and testing – Fluid pressure gauge – Mounting and connection

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07490520

ABSTRACT:
A pressure sensor, which is to be used in an environment involving vibrations, includes a case and a sensor chip. The case has an inner surface that is to be disposed perpendicular to a direction of the vibrations. The sensor chip is to sense a pressure in the environment and generate a sensing signal representative of the sensed pressure. The sensor chip has a pressure-receiving surface and is secured in the case with the pressure-receiving surface perpendicular to the inner surface of the case. With such an arrangement, since the pressure-receiving surface of the sensor chip is accordingly to be parallel to the direction of the vibrations, the influence of the vibrations on the pressure-receiving surface can be minimized. Consequently, high accuracy of the pressure sensor can be ensured.

REFERENCES:
patent: 5554809 (1996-09-01), Tobita et al.
patent: 5625151 (1997-04-01), Yamaguchi
patent: 7152480 (2006-12-01), Nomura
patent: 7216546 (2007-05-01), Hayashi et al.
patent: 7225679 (2007-06-01), Miyagawa et al.
patent: H04-216676 (1992-08-01), None
patent: H08-261852 (1996-10-01), None
patent: H09-113393 (1997-05-01), None
patent: 2004-294295 (2004-10-01), None
patent: 2006-023109 (2006-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pressure sensor having improved arrangement of sensor chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure sensor having improved arrangement of sensor chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure sensor having improved arrangement of sensor chip... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4107657

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.