Measuring and testing – Fluid pressure gauge – Mounting and connection
Patent
1997-12-01
2000-02-08
Oen, William
Measuring and testing
Fluid pressure gauge
Mounting and connection
G01L 700
Patent
active
060216743
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to concerns a pressure sensor comprising a housing, a support plate arranged on a mounting surface of the housing, a sensor element arranged in the housing, and at least one connector element joined in electrically conductive fashion to at least one contact surface of the support plate.
German Patent No. DE 43 13 312 A1. In the case of this pressure sensor, the electrical connector elements and the support plate with electrical/electronic components located on it, as well as a sensor element, are each arranged separately in the housing. The pressure sensor, support plate, and electrical connector elements are each joined to one another in electrically conductive fashion by means of bonded wires.
The above described pressure sensor has the disadvantage, on the one hand, that manufacture is comparatively complex, since the electrical connector elements, the support plate, and the sensor element must each be arranged separately in the housing. On the other hand, contacting by means of bonded wires proves to be particularly disadvantageous specifically for a pressure sensor, since bonded wires of this kind are very sensitive, so that--in particular in the case of exposure to a medium under pressure--there exists the risk of damage to and thus destruction of the pressure sensor.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to develop a pressure sensor of this kind in such a way that it is not only easy to manufacture, but also exhibits very good resistance to malfunction and, as a consequence thereof, very high reliability even over a long period of time.
This is achieved according to the present invention, by the fact that the at least one connector element is arranged flush with the mounting surface, is joined directly to the at least one contact surface, and a capillary adhesive layer is arranged between the support plate and the mounting surface.
The arrangement of the at least one connector element flush with the mounting surface, and directly contacting with the at least one contact surface of the support surface, has the particularly great advantage that absolutely no sensitive bonded wires need to be provided in order to join the connector elements to the support plate, thus not only substantially simplifying manufacture, but moreover also increasing resistance to malfunction and, as a consequence thereof, operability over a long period of time.
The arrangement of a capillary adhesive layer between the support plate and the mounting surface has the great advantage of making possible, as it were, "one-piece" joining of the support plate to the mounting surface and thus the housing. Said capillary adhesive layer improves, in particular, the stability of the join between the support plate and the mounting surface, i.e. the housing, and thus also constitutes protection for the joins between the contact surfaces and the connector elements. The use of a capillary adhesive for this adhesive layer has the great advantage that said capillary adhesive flows into the tiniest pores between the mounting surface and the support plate, thus producing a particularly solid "monolithic" join.
With regard to joining of the connector elements and the contact surface, a wide variety of embodiments is conceivable. For example, provision can be made for the join between the connector elements and the contact surfaces to be a solder join.
In addition, an adhesive join can also be provided, in which case a conductive adhesive is used to make the join.
In both cases, the contact surfaces, which in most cases are printed, can thus be joined to the connector elements by means of SMD technology.
It is particularly advantageous that the capillary adhesive surrounds the electrically conductive join between the connector elements and the contact surfaces, and seals it against the environment. This not only--as already mentioned above--increases stability and reduces the (shear) forces acting on the join between the contact surfaces and the connecto
REFERENCES:
patent: 4295117 (1981-10-01), Lake et al.
patent: 4675643 (1987-06-01), Tanner et al.
patent: 4735098 (1988-04-01), Kavli et al.
patent: 5257547 (1993-11-01), Boyer
Goebel Ulrich
Roethlingshoefer Walter
Weiblen Kurt
Oen William
Robert & Bosch GmbH
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