Measuring and testing – Fluid pressure gauge – Mounting and connection
Patent
1998-12-28
2000-04-11
Felber, Joseph L.
Measuring and testing
Fluid pressure gauge
Mounting and connection
73727, 73754, 257419, G01L 906
Patent
active
060476044
ABSTRACT:
The pressure sensor component is mountable on the component-mounting surface of a printed circuit board. The component has a chip carrier of electrically insulating material formed with a substantially flat chip carrier surface. A semiconductor chip with a pressure sensor is fastened on the chip carrier surface. Electrode connections with a surface-mountable structure penetrate the chip carrier and they are electrically connected to the semiconductor chip. The chip carrier is filled with a flowable filler completely covering the semiconductor chip.
REFERENCES:
Japanese Patent Abstract No. 4-127461 a (Sonobe), dated Apr. 28, 1992.
Japanese Patent Abstract No. JP41 25438 (Masahiro), dated Apr. 24, 1992.
Japanese Patent Abstract No. JP4323909 (Jun), dated Nov. 13, 1992.
Japanese Patent Abstract No. JP7113706 (Kazuyuki), dated May 2, 1995.
Japanese Patent Abstract JP8017870 (Kazuya et al.), dated Jan. 19, 1996.
Japanese Patent Abstract No. 5-3284 (a) (Nishino), dated Jan. 8, 1993.
Victor J. Adams: "Epoxy Package for Pressure Sensor", Motorola Inc, Technical Developments, vol. 12, Apr. 1991, p. 154.
Auburger Albert
Winterer Jurgen
Felber Joseph L.
Greenberg Lawrence A.
Lerner Herbert L.
Siemens Aktiengesellschaft
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