Pressure sensor and manufacturing method of pressure sensor

Details Pressure sensor and manufacturing method of pressure sensor Pressure sensor and manufacturing method of pressure sensor

2005-09-06

2005-09-06

Lefkowitz, Edward (Department: 2855)

Measuring and testing

Fluid pressure gauge

Electrical

C029S592000

Reexamination Certificate

active

06938492

ABSTRACT:
A bonding pad for outputting an output of a piezoresistive element to an integrated circuit is disposed on one side of a sensor substrate, and the sensor substrate is adhered to a package at only a rear side of the bonding pad.

REFERENCES:
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patent: 6250152 (2001-06-01), Klein et al.
patent: 6446510 (2002-09-01), Kurtz et al.
patent: 6755084 (2004-06-01), Tsukada et al.
patent: 2004/0182166 (2004-09-01), Jones et al.
patent: 11-118642 (1999-04-01), None

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